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RPA Electronic Solutions

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Mar 14th

FIO Roadmap

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Roadmap
RPA will continue to add high performance cards to our family of standard products.  This includes expanding our FIO cards and I/O specific cards like the HVIO-FIO. 

Current FIO I/O boards that are within 12-18 months of being released are the following cards.

GbE-FIO
The GbE-FIO card will expand our latest FIO architecture to include a dual 1Gb Ethernet port interfaces directly to the FPGA, thereby granting the user a high speed I/O data path to the host PC.  The user will still retain access to the other high performance features of the FIO architecture such as the Blackfin DSP, 64MB SDRAM, flexible clock timing generator and the myriad I/O device interfaces.

GbE-FIO


PCIe-FIO
The PCIe-FIO card will expand our latest FIO architecture to include a 1x lane PCIe interface directly to the FPGA, thereby granting the user a high speed I/O data path to the host PC.  The user will still retain access to the other high performance features of the FIO architecture such as the Blackfin DSP, 64MB SDRAM, flexible clock timing generator and the myriad I/O device interfaces.

PCIe FIO


Custom Products
RPA can also provide a complete product solution for our customers, from design to production.  Over the years RPA has successfully completed many projects that have broadened our design experience.  As with any company with broad design experience, it’s hard to describe in words what we can do for you.  Please visit our Request Info web page to tell us about your requirements.
 
Call 607-771-0393 or Click for More Info

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